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ON SEMICONDUCTOR CORP (ON)

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Security holder agreements
TypeNameDate
IndentureIndenture, among the Company, the guarantors party thereto and Wells Fargo Bank, National Association05/19/2021
IndentureIndenture, among the Company, the guarantors party thereto and Wells Fargo Bank, National Association08/21/2020
IndentureIndenture, among the Company, the guarantors party thereto and Wells Fargo Bank, National Association08/21/2020
Credit agreementFifth Amendment to Credit Agreement, by and among ON Semiconductor, as borrower, the subsidiary guarantors party thereto, Deutsche Bank AG New York Branch, as administrative agent, collateral agent and issuing lender, the 2019 Incremental Revolving Lenders and the New Required Lenders party thereto06/17/2019
Credit agreementFifth Amendment to Credit Agreement, by and among ON Semiconductor, as borrower, the subsidiary guarantors party thereto, Deutsche Bank AG New York Branch, as administrative agent, collateral agent and issuing lender, the 2019 Incremental Revolving Lenders and the New Required Lenders party thereto06/17/2019
Credit agreementAmendment No. 3, to Credit Agreement, by and among the Company, the guarantors party thereto, Deutsche Bank AG New York Branch, as administrative agent, and the several lenders party thereto12/04/2017
Credit agreementAmendment No. 3, to Credit Agreement, by and among the Company, the guarantors party thereto, Deutsche Bank AG New York Branch, as administrative agent, and the several lenders party thereto12/04/2017
Credit agreementAmendment No. 2, to Credit Agreement, by and among the Company, the guarantors party thereto, Deutsche Bank AG New York Branch, as administrative agent, and the several lenders party thereto04/03/2017
IndentureIndenture, among the Company, the guarantors party thereto and Wells Fargo Bank, National Association04/03/2017
Credit agreementFirst Amendment to Credit Agreement, among ON Semiconductor Corporation, as borrower, certain subsidiaries thereof, as guarantors, the several lenders party thereto, and Deutsche Bank AG, New York Branch, as administrative agent and collateral agent09/30/2016
IndentureSecond Supplemental Indenture, among ON Semiconductor Corporation, the guarantors party thereto and Wells Fargo Bank, National Associate, as trustee04/15/2016
IndentureSecond Supplemental Indenture, among ON Semiconductor Corporation, the guarantors party thereto and Deutsche Bank Trust Companies Americas, as trustee04/15/2016
IndentureSupplemental Indenture, among ON Semiconductor Corporation, the guarantors party thereto and Wells Fargo Bank, National Associate, as trustee03/17/2016
IndentureSupplemental Indenture, among ON Semiconductor Corporation, the guarantors party thereto and Deutsche Bank Trust Companies Americas, as trustee03/17/2016
IndentureIndenture, among the Company, the guarantors party thereto and Wells Fargo Bank, National Association06/08/2015
Credit agreementAmendment No. 2, to Amended and Restated Credit Agreement, by and among the Company, Semiconductor Components Industries, LLC, the lenders party thereto and JPMorgan Chase Bank, N.A., as administrative agent06/03/2015
Credit agreementAmended and Restated Credit Agreement, by and among ON Semiconductor Corporation, Semiconductor Components Industries, LLC, the lenders party thereto, JPMorgan Chase Bank, N.A., as Administrative Agent, and the other parties thereto, as amended by Amendment No. 1 thereto05/04/2015
Credit agreementAmended and Restated Credit Agreement, by and among ON Semiconductor Corporation, Semiconductor Components Industries, LLC, the lenders party thereto, JPMorgan Chase Bank, N.A., as Administrative Agent, and the other parties thereto, as amended by Amendment No. 1 thereto05/04/2015
IndentureIndenture among the Company, the Subsidiary Guarantors and Deutsche Bank Trust Company Americas, as Trustee12/19/2011


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