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QUALCOMM INC (QCOM)

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Security holder agreements
TypeNameDate
Credit agreementCredit Agreement among QUALCOMM Incorporated, the lenders party thereto, the letter of credit issuers party thereto and Bank of America, N.A., as administrative agent, swing line lender and a letter of credit issuer12/10/2020
Registration rights agreementRegistration Rights Agreement08/18/2020
Registration rights agreementRegistration Rights Agreement06/05/2018
Credit agreementAMENDMENT NO. 1 TO CREDIT AGREEMENT04/24/2018
Credit agreementCREDIT AGREEMENT03/09/2018
Credit agreementCredit Agreement among QUALCOMM Incorporated, the lenders party thereto and Goldman Sachs Bank USA, as Administrative Agent11/09/2016
Credit agreementAmended and Restated Credit Agreement among QUALCOMM Incorporated, the lenders party thereto and Bank of America, N.A., as Administrative Agent11/09/2016
IndentureIndenture, between the Company and U.S. Bank National Association, as trustee05/21/2015
Credit agreementRevolving Credit Agreement among Qualcomm Incorporated, the lenders party thereto and Bank of America, N.A., as Administrative Agent02/18/2015


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